JPH0466385B2 - - Google Patents

Info

Publication number
JPH0466385B2
JPH0466385B2 JP62050693A JP5069387A JPH0466385B2 JP H0466385 B2 JPH0466385 B2 JP H0466385B2 JP 62050693 A JP62050693 A JP 62050693A JP 5069387 A JP5069387 A JP 5069387A JP H0466385 B2 JPH0466385 B2 JP H0466385B2
Authority
JP
Japan
Prior art keywords
plating
conductive line
wiring lead
film
film substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP62050693A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63216353A (ja
Inventor
Yoshio Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Consejo Superior de Investigaciones Cientificas CSIC
Shindo Denshi Kogyo KK
Original Assignee
Consejo Superior de Investigaciones Cientificas CSIC
Shindo Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consejo Superior de Investigaciones Cientificas CSIC, Shindo Denshi Kogyo KK filed Critical Consejo Superior de Investigaciones Cientificas CSIC
Priority to JP62050693A priority Critical patent/JPS63216353A/ja
Publication of JPS63216353A publication Critical patent/JPS63216353A/ja
Publication of JPH0466385B2 publication Critical patent/JPH0466385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Wire Bonding (AREA)
JP62050693A 1987-03-05 1987-03-05 フイルムキヤリア Granted JPS63216353A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62050693A JPS63216353A (ja) 1987-03-05 1987-03-05 フイルムキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62050693A JPS63216353A (ja) 1987-03-05 1987-03-05 フイルムキヤリア

Publications (2)

Publication Number Publication Date
JPS63216353A JPS63216353A (ja) 1988-09-08
JPH0466385B2 true JPH0466385B2 (en]) 1992-10-23

Family

ID=12866003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62050693A Granted JPS63216353A (ja) 1987-03-05 1987-03-05 フイルムキヤリア

Country Status (1)

Country Link
JP (1) JPS63216353A (en])

Also Published As

Publication number Publication date
JPS63216353A (ja) 1988-09-08

Similar Documents

Publication Publication Date Title
US2777193A (en) Circuit construction
US20040092136A1 (en) Method and apparatus for electrolytic plating of surface metals
JPH0268988A (ja) 表面実装プリント配線板
JPH08107263A (ja) プリント配線板の製造方法
JPH0466385B2 (en])
JP2000091722A (ja) プリント配線板及びその製造方法
JP2741238B2 (ja) フレキシブルプリント配線板及びその製造方法
JP2700259B2 (ja) プリント配線板における凹所を有する半田層の形成方法
JPH10233563A (ja) プリント配線基板及びその製造方法
JP4150464B2 (ja) ２メタルテープキャリアパッケージとその製造方法
JP3095857B2 (ja) 電子部品搭載用基板
JPS5892291A (ja) プリント配線板の製造方法
JPH07193343A (ja) プリント配線基板およびその分割方法
JPH05327184A (ja) 電子部品搭載用基板の製造方法
JPH0558661B2 (en])
JPH0669634A (ja) プリント配線板の製造方法
JPH08172256A (ja) プリント配線板及びその製造方法
JP2942401B2 (ja) メッキ用治具
JP2001035962A (ja) 半導体パッケージ用基板の製造方法
JPH02125497A (ja) 印刷配線基板
JPH01119034A (ja) 電子部品搭載用フイルムキャリア
JP2511476B2 (ja) プリント配線板の金めっき法
JP2755028B2 (ja) グラウンド金属プレーン付きコプレナー型テープキャリアの製造方法
JPS614295A (ja) プリント配線板の製造方法
JPS592400B2 (ja) プリント板の製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees